doc. no : qw0905- rev. : a date : 23 - aug. - 2006 lhg3392/r1-pf data sheet ligitek electronics co.,ltd. property of ligitek only dual color led lamps lhg3392/r1-pf pb lead-free parts
18.0min 50% 1 2 3 2.0min 0.5 typ 2.54typ note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 100%75% -30 -60 directivity radiation 50% 0 25%25%100% 75% 30 60 0 2.54typ 2.0min 1.cathode green 2.common anode 3.cathode red 3 2 1 - + - 1.5max part no. lhg3392/r1-pf package dimensions 5.9 5.0 10.5 0.5 8.6 7.6 g h page 1/6 ligitek electronics co.,ltd. property of ligitek only
storage temperature operating temperature reverse current @5v peak forward current duty 1/10@10khz power dissipation forward current parameter note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. lhg3392/r1-pf white diffused gap green red 56530 69790 76 76 1.72.61.8 1.2 1.72.60.25 0.1 typical electrical & optical characteristics (ta=25 ) part no spectral halfwidth nm lens material color emitted peak wave length pnm viewing angle 2 1/2 (deg) luminous intensity @10ma(mcd) forward voltage @20ma(v) min. min.max. typ. -40 ~ +100 tstg 2/6 page absolute maximum ratings at ta=25 10 -40 ~ +85 ir t opr pd40 i fp 60 a 100 mw 120 ma ratings symbol h i f 15 g 30 ma unit ligitek electronics co.,ltd. property of ligitek only gap lhg3392/r1-pf part no.
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/6 page lhg3392/r1-pf part no.
4/6 g chip 3.5 3.0 2.5 1.5 1.0 0.5 0.0 2.0 60100 80 02040 -40-20 0.9 0.8 100 80 5.0 4.0 3.0 2.0 1.0 0.5 0.0 650 600 550 500 1.2 1.1 1.0 60 40 20 0 -20 -40 3.0 2.5 2.0 1.5 1.0 0.5 0.0 1000 100 10 1.0 1000 100 10 1.0 0.1 1.0 ligitek electronics co.,ltd. property of ligitek only r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.2 relative intensity vs. forward current forward current(ma) page f o r w a r d c u r r e n t ( m a ) fig.1 forward current vs. forward voltage forward voltage(v) typical electro-optical characteristics curve r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ambient temperature( ) fig.4 relative intensity vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) r e l a t i v e i n t e n s i t y @ 2 0 m a ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature lhg3392/r1-pf part no.
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 120 60 seconds max preheat 2 /sec max 0 0 25 50 100 time(sec) 150 260 5 /sec max 260 c3sec max temp( c) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 lhg3392/r1-pf part no.
1.t.sol=230 5 2.dwell time=5 1sec 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs solderability test thermal shock test solder resistance test high temperature high humidity test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition operating life test low temperature storage test high temperature storage test test item reliability test: 6/6 page this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 description reference standard ligitek electronics co.,ltd. property of ligitek only lhg3392/r1-pf part no.
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